Grain boundary high resolution

Grain boundary segregation

Extending the crystal placticity model [2.1] to investigate how grain pairs interact will increase our understanding of how deformation traverses interfaces. In the general case for bcc and fcc metals we hope to be able to calculate how the angle between the interfacial plane orientation and the stress axis influences deformation movement across interfaces. The results from these studies are to be exploited in the crystal-level modelling of steel microstructures in order to rank microstructures for performance.

Understanding deformation transport will give us a better understanding of deformation processing of the RE-free alloys developed in RT1.3. The key will be to avoid twinning during the early stage of hot deformation by careful consideration of the strain path, temperature and rate. Experimental work will also be undertaken to examine the microstructures / microtextures produced, especially the effect of recrystallisation, and how this knowledge might be used in process optimisation.

With a knowledge of how deformation translates from grain to grain, we can look at the processing of TWIP and multiphase steels to produce optimal textures for high strength or high ductility materials. [1.1]

We also hope that this work will improve our understanding of hard precipitates (carbides) at grain boundaries.

Featured Image: Grain boundary at atomic resolution.
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